1. INTEL® P55 Express Chipset
2. Support INTEL® LGA1156 Processors
3. Supports PCI-Express 2.0
4. Supports Dual Channel DDR3 1333/1066
5. Onboard Gigabit LAN and e-SATA
6. Integrated ALC883 HD Audio CODEC with 8.0 CH
7. Integrated Serial ATA2 3Gb/s with RAID function
8. Support 3D Audio Technology
9. Support G.P.I Technology
10. Support WIFI Tecgnology
11. Supports ATI CrossFireX Technology
12. Ready for Windows® Vista™
13. ATX Form Factor(305mm X 215mm)

Overview

PCI Express 2.0 Buses
The PCI Express 2.0 x16 graphics delivers up to 8 GB/s per direction, 2 times more bandwidth than PCI Express x16 and up to 16 GB/s concurrent bandwidth. PCI Express x1 I/O offers 1GB/s concurrently, over 7 times more bandwidth than AGP8X, tackling the most demanding multimedia tasks nowadays

Serial ATA2 3Gb/s&RAID ,e-SATA
This platform supports reliable storage solution for enhanced data protection and data accessing performance. Serial ATA 3Gb/s is firstly introduced in this platform to provide blazingly 3Gb/s bus bandwidth thus higher disk performance. The SATA RAID allows multi-disk designs to be set up as RAID 0, 1,10 based on users’ priority of protection/performance, and which even makes more accessible by introducing the innovative windows-based facility
E-SATA is a new standard for external storage devices. With an external data transfer rate of up to 3 Gb/s no other external data transfer solution can compete with speed and ease of use

OC-CON high-polymer solid electrolysis aluminum capacitors embedded
The working temperature is from 55 degrees Centigrade below zero to 125 degrees Centigrade, OC_CON capacitors possess superior physical characteristics that can be while reducing the working temperature between 20 degrees Centigrade each time, intact extension 10 times of effective product operation lives, at not rising degrees Centigrade of working temperatures each time a relative one, life of product decline 10% only too.

DIY Clear CMOS Functions
Initiate the DIY-Clear button, set on the IO back panel especially .when enjoying the over-clocking ,the power users can clear the CMOS without opening the case .The humanization design is convenient for the users .

Hyper Transport Technology 3.0
The highly scalable Hyper Transport 3.0 is capable to provide incredible bandwidth of the system bus up to 20.8GB/s which would dramatically elevate the efficiency of computing performance.

WI-FI Technology
WIFI--Full name is wireless Fidelity. It has been used in Notebook,mobile phone,PDA,digital cameras and Mobile Terminals widely.With WIFI. We do not need to worry about the speed and high spending when we dailing long-distance calls,browsing web pages,receiving and sending E-mails,loading music,delivering digital photos.

Jetway G.P.I Technology
G.P.I is the acronym for the “Green Power Indicator” technology. Jetway’s motherboard series with G.P.I technology have a specially designed chip for real-time detecting CPU workload. The green power indicator will automatically turn off when CPU workload is heavy and turn on when CPU workload is light to indicate power saving mold being activated.